Document :

ITU-T SG 5  (Study Period 2013)  Temporary Document  376-GEN

Title :

K.77 Appendix I Characterizing thermally protected MOVs using a.c. step stress testing

Date :

2013-12-09

Source :

Rapporteur Q2/5

AI/Question :

Q2/5

Access :

Restricted to TIES users [ITU-T]