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[664]  The projects proposal of Slicing Channel Layer of Slicing Packet Network(SPN)

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Document :

ITU-T SG 15  (Study Period 2017)  Contribution  664

Title :

The projects proposal of Slicing Channel Layer of Slicing Packet Network(SPN)

Date :

2018-01-16

Source :

Broadcom Corporation , China Mobile Communications Corporation , EXFO Inc. , FiberHome Technologies Group , Huawei Technologies Co., Ltd. , Microsemi Corporation , Ministry of Industry and Information Technology (MIIT) , Telefon AB - LM Ericsson , Telefónica S.A. , Viavi Solutions Deutschland GmbH , ZTE Corporation

AI/Question :

Q10/15, Q11/15, Q12/15, Q14/15, Q9/15

Meeting :

2018-01-29

Access :

Restricted to TIES users [ITU-T]

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