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Study Period 2022

Results:8 total items.
Contributions  [ Source: Keio University (Japan) ]  [ AI/Question: Q26/16 ]   Documents / Contributions
 
Number 
Title Source AI/Question
Date
[ 601 ]  
 
New: HSTP.ACC-MV-Sustainable: Proposed new work item on "Technical paper on accessibility in a sustainable metaverse"     Keio University (Japan) , National Institute of Information and Communications Technology (NICT) (Japan) , Oki Electric Industry Company Ltd. (OKI) (Japan) , Universitat Autònoma de Barcelona (Spain)   Q26/16   2024-04-02
[ 599 ]  
(Rev.1) 
New: HSTP-ACC-MV-Interpreting: Proposed new work item on "Technical paper on Guidelines and requirements on interpreting in the metaverse"     Keio University (Japan) , National Institute of Information and Communications Technology (NICT) (Japan) , Oki Electric Industry Company Ltd. (OKI) (Japan) , Universitat Autònoma de Barcelona (Spain)   Q26/16   2024-04-02
[ 598 ]  
 
New: HSTP-ACC-MV-Guideline: Proposed new work item on "Technical paper on Guidelines to assess inclusion and accessibility in metaverse standard development"     Keio University (Japan) , National Institute of Information and Communications Technology (NICT) (Japan) , Oki Electric Industry Company Ltd. (OKI) (Japan) , Universitat Autònoma de Barcelona (Spain)   Q26/16   2024-04-02
[ 513 ]  
(Rev.1) 
H.MD-DiDRR: Proposal to update     Keio University (Japan)   Q26/16   2024-04-02
[ 511 ]  
 
FSTP-ACC-AI: Proposal to add appendices and update bibliography  
This document was reposted by TSB after minor editorial adjustments.
 
Keio University (Japan)   Q26/16   2024-04-02
[ 510 ]  
 
New: F.930: Proposal to revise existing Recommendation  
This document was reposted by TSB after minor editorial adjustments.
 
Keio University (Japan)   Q26/16   2024-04-02
[ 349 ]  
(Rev.1) 
FSTP-ACC-AI: Proposed updates     Keio University (Japan)   Q26/16   2023-06-27
[ 105 ]  
 
FSTP-ACC-WebVRI (V2): Proposal to add text and submit for Approval     Keio University (Japan)   Q26/16   2022-10-01
Results:8 total items.
 
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