Page 214 - Cloud computing: From paradigm to operation

1 Framework and requirements for cloud computing

Table I.5 – Relationship with related specifications from other SDOs

NO. Requirements in this Relationship with related specifications from other SDOs
Recommendation
27 Circulation of air flow – [b-OCP 1S] provides air flow set as 'The card level air baffle must be
designed to help maintain temperatures of all major components on the
server card by reducing bypass air and increasing airflow through key
components' in clause 6.6.
– [b-OCP 2S] provides airflow set as 'The unit of airflow (or volumetric flow)
used for this spec is CFM (cubic feet per minute).The maximum allowable
airflow per watt in the system must be 0.107' in clause 10.2.26.
– [b-OCP JBOG] provides system airflow set as 'The unit of airflow
(or volumetric flow) used for this spec is CFM (cubic feet per minute). The
maximum allowable airflow per watt in the system must be 0.14 at sea
level' in clause 8.2.3.
– [b-OCP SJ] provides cooling set as 'To meet thermal reliability requirement,
the thermal and cooling solution should dissipate heat from the
components when system operating at its maximum thermal power' in
clause 11.
– [b-OCP Yose] provides airflow set as 'The unit of airflow (or volumetric flow)
used for this spec is cubic feet per minute (CFM)' in clause 8.2.5.
28 Interconnect network – [b-ETSI EVE007] provide interconnect network supports as 'support links of
supports types other than Ethernet' in clause 5.4.2.
– [b-OCP 1S] provides interconnect set as 'When the SoC's integrated network
controller is used as a shared NIC, its SMBus is routed to Connector A as the
sideband interface' in clause 7.9.1.
– [b-OCP 2S] provides interconnect set as 'High speed mid-plane is mid-plane
with power delivery, plus high speed interconnect on mid-plane' in
clause 12.3.
– [b-OCP JBOG] provides interconnect set as 'For JBOG with 8x GPUs in SXM2
form factor, it shall support NVLINK interconnection shown below' in
clause 4.3.
29 Sharing process unit – [b-OCP 2S] provides share SPI bus set as 'A secondary identical BIOS chip is
component designed in sharing the same SPI bus with multiplexedCS pin' in clause 6.1.
– [b-OCP OBIOS] provides share io set as 'ATA controllers running in native
mode use their PCI interrupt for both channels and can share this interrupt
with other devices in the system, like any other PCI device' in clause 7.3.1.2.
30 Network topology – [b-OCP OCSB] provides topology set as 'CPU-to-tray backplane mezzanine
PCIe link topology' in clause 7.1.
31 Configuration of – [b-OCP 1S] provides configuration set as 'Set Bridge IC configuration' in
multiple processing clause 9.7.10, Table 6.
units – [b-OCP 2S] provides configuration set as 'Vendor should provide utility
under CentOS to perform VR configuration change. Configuration change
should take effect without AC cycling node' in clause 15.3.4.
– [b-OCP OBIOS] provides multi process configuration set as 'The Intel Xeon
Scalable processor is implemented with 1 or more cores with each core
capable of supporting Intel HT Technology. The result is multiple logical
processors in a physical package' in clause 4.13.

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