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Work item:
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K.77 Appendix III (ex New App. K.77)
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Subject/title:
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Characterizing thermally protected MOVs using a.c. step stress testing
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Status:
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Agreed on 2013-12-13
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Approval process:
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Agreement
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Type of work item:
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Recommendation
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Version:
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New
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Equivalent number:
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-
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Timing:
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-
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Liaison:
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-
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Supporting members:
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-
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Summary:
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This Appendix gives a general procedure to characterize the performance of the thermal disconnect of a thermally protected MOV using a.c. step stress testing.
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Comment:
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was approved in plenary as Appendix I but is in fact Appendix III, and will be published as K.77(2009)Amd.1 - new Appendix III
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Reference(s):
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Historic references:
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Contact(s):
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| ITU-T A.5 justification(s): |
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First registration in the WP:
2013-12-09 00:00:00
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Last update:
2014-01-20 15:34:50
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